Hoʻopau Pōmaikaʻi ʻo Hanpai Mold i ka Semina ʻenehana Die Ring ʻElua

Ma Malaki 30, 2024, ua mālama ʻo Hangzhou Hanpai Mold Technology Co., Ltd. i ka lua o ka Ring Die Technology Seminar, e kono ana i nā malihini mahalo ʻia e like me Professor Ling Guoping mai ke Kulanui o Materials Science and Engineering ma Zhejiang University, Hope Pelekikena Guo Xiaogang mai ka Hangzhou Institute. o Mechanical Science, Senior Engineer Shen Liang, Hope Luna Nui Fang Jianjun, Luna Nui Yan Laiping, a me Engineer Wang Yong mai Liyang Jinkun Forging Co., Ltd.

I loko o kēia ʻaha kūkā, ua hoʻohuli ʻia nā kūkākūkā e pili ana i ka nānā ʻana i nā hemahema ring die ma 2023. Ua ʻimi ka poʻe loea i nā mea hiki ke hana a me nā nāwaliwali e hāʻawi ana i nā hemahema o ka ring die, e komo i nā kamaʻilio hohonu e pili ana i ia mea.Eia kekahi, ua noi lākou i nā hoʻomaikaʻi kūpono a me nā hoʻolālā hoʻolālā e pili ana i nā mea a me nā ʻenehana mālama wela.