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Hanpai Pwm Ua tiav Lub Nplhaib Thib Ob Die Technology Semina

Thaum Lub Peb Hlis 30, 2024, Hangzhou Hanpai Mould Technology Co., Ltd. tau tuav lub Ring Die Technology Seminar thib ob, caw cov qhua suav nrog xibfwb Ling Guoping los ntawm College of Materials Science thiab Engineering ntawm Zhejiang University, Tus Lwm Thawj Coj Guo Xiaogang los ntawm Hangzhou Institute ntawm Mechanical Science, Senior Engineer Shen Liang, Tus Lwm Thawj Coj General Fang Jianjun, Chief Engineer Yan Laiping, thiab Engineer Wang Yong los ntawm Liyang Jinkun Forging Co., Ltd.

Thaum lub rooj sib tham no, cov kev sib tham tau hloov pauv los ntawm kev txheeb xyuas lub nplhaib tuag ua tsis tiav hauv 2023. Cov kws tshaj lij tau txheeb xyuas cov khoom siv thiab cov txheej txheem tsis zoo uas ua rau lub nplhaib tuag ua tsis tiav, koom nrog kev sib tham tob txog qhov teeb meem.Tsis tas li ntawd, lawv tau npaj cov kev txhim kho zoo sib xws thiab cov phiaj xwm ua kom zoo txog cov khoom siv thiab cov thev naus laus zis kho cua sov.

Thib Ob Ring Die Technology Seminar (1) Thib Ob Ring Die Technology Seminar (2) Thib Ob Ring Die Technology Seminar (3) Thib Ob Ring Die Technology Seminar (4)


Post lub sij hawm: May-27-2024