On March 30, 2024, Hangzhou Hanpai Mould Technology Co., Ltd. hosted the second Ring Die Technology Seminar, inviting esteemed guests including Professor Ling Guoping from the College of Materials Science and Engineering at Zhejiang University, Vice President Guo Xiaogang from the Hangzhou Institute of Mechanical Science, Senior Engineer Shen Liang, Vice General Manager Fang Jianjun, Chief Engineer Yan Laiping, and Engineer Wang Yong from Liyang Jinkun Forging Co., Ltd.
During this conference, discussions revolved around the analysis of ring die failures in 2023. Experts delved into potential material and process vulnerabilities contributing to ring die failures, engaging in in-depth conversations on the matter. Moreover, they proposed corresponding improvements and optimization plans concerning materials and heat treatment technologies.
Post time: May-27-2024