Hanpai Mold Yamaliza Bwino Semina Yachiwiri ya Ring Die Technology

Pa Marichi 30, 2024, Hangzhou Hanpai Mold Technology Co., Ltd. adachita Semina yachiwiri ya Ring Die Technology, kuyitanitsa alendo olemekezeka kuphatikiza Pulofesa Ling Guoping wa ku College of Materials Science and Engineering ku Zhejiang University, Wachiwiri kwa Purezidenti Guo Xiaogang wochokera ku Hangzhou Institute. of Mechanical Science, Senior Engineer Shen Liang, Vice General Manager Fang Jianjun, Chief Engineer Yan Laiping, ndi Engineer Wang Yong ochokera ku Liyang Jinkun Forging Co., Ltd.

Pamsonkhanowu, zokambirana zinali zokhudzana ndi kuwunika kwa ring die failures mu 2023. Akatswiri adafufuza zomwe zingatheke komanso zowonongeka zomwe zimapangitsa kuti ring die iwonongeke, ndikukambirana mozama pa nkhaniyi.Kuphatikiza apo, adapereka malingaliro ofananirako ndi mapulani okhathamiritsa okhudzana ndi zida ndi matekinoloje ochizira kutentha.