Hanpai Mold Yatsinze Intsinzi ya kabiri Impeta Yikoranabuhanga Semina

Ku ya 30 Werurwe 2024, Hangzhou Hanpai Mold Technology Co., Ltd yakiriye amahugurwa ya kabiri ya Ring Die Technology Technology, atumira abashyitsi bubahwa barimo Porofeseri Ling Guoping wo mu Ishuri Rikuru ry’Ubumenyi n’Ubwubatsi muri kaminuza ya Zhejiang, Visi Perezida Guo Xiaogang wo mu kigo cya Hangzhou yubumenyi bwa mashini, injeniyeri mukuru Shen Liang, umuyobozi mukuru wungirije Fang Jianjun, injeniyeri mukuru Yan Laiping, na injeniyeri Wang Yong wo muri Liyang Jinkun Forging Co., Ltd.

Muri iyi nama, ibiganiro byibanze ku isesengura ry’impanuka zipfa mu 2023. Impuguke zacukumbuye intege nke zishobora guterwa no kunanirwa n’impanuka zitera kunanirwa impeta, bagirana ibiganiro byimbitse kuri iki kibazo.Byongeye kandi, basabye ko hajyaho uburyo bunoze bwo kunoza no gutezimbere ibijyanye n’ibikoresho n’ikoranabuhanga ryo gutunganya ubushyuhe.