I le aso 30 o Mati, 2024, na talimalo ai Hangzhou Hanpai Mold Technology Co., Ltd. i le Seminare lona lua o Ring Die Technology, ma valaaulia ai malo faaaloalogia e aofia ai Polofesa Ling Guoping mai le Kolisi o Materials Science and Engineering i le Iunivesite o Zhejiang, Sui Peresetene Guo Xiaogang mai le Inisetiute a Hangzhou o Saienisi Faʻainisinia, Inisinia Sinia Shen Liang, Sui Pule Sili Fang Jianjun, Inisinia Sili Yan Laiping, ma Inisinia Wang Yong mai Liyang Jinkun Forging Co., Ltd.
I le taimi o lenei konafesi, o talanoaga na faʻataʻamilo i le auʻiliʻiliga o faʻaletonu mama mama i le 2023. Na suʻesuʻe e le au popoto i mea e mafai ona faʻaogaina ma faʻalavelave faʻaletonu e mafua ai le toilalo mama, auai i talanoaga loloto i le mataupu.E le gata i lea, na latou tuʻuina atu faʻalelei tutusa ma fuafuaga faʻapitoa e uiga i meafaitino ma tekonolosi togafitiga vevela.
Taimi meli: Me-27-2024