Musi waKurume 30, 2024, Hangzhou Hanpai Mold Technology Co., Ltd. yakabata yechipiri Ring Die Technology Semina, ichikoka vashanyi vanoremekedzwa vanosanganisira Muzvinafundo Ling Guoping kubva kuCollege of Materials Science and Engineering paZhejiang University, Mutevedzeri weMutungamiri Guo Xiaogang kubva kuHangzhou Institute. weMechanical Science, Senior Engineer Shen Liang, Mutevedzeri Mukuru Maneja Fang Jianjun, Chief Engineer Yan Laiping, uye Injiniya Wang Yong kubva kuLiyang Jinkun Forging Co., Ltd.
Mukati memusangano uyu, nhaurirano dzakatarisana nekuongorora kutadza kufa kwemhete muna 2023. Nyanzvi dzakatsvaga mune zvingangove zvinhu uye maitiro ekusagadzikana anokonzera kukanganisa kufa kwemhete, kuita hurukuro dzakadzama nezvenyaya iyi.Zvakare, ivo vakakurudzira kuvandudzwa kunoenderana uye zvirongwa zve optimization zvine chekuita nemidziyo uye tekinoroji yekurapa kupisa.
Nguva yekutumira: May-27-2024