Hanpai Mold wuxuu si guul leh u soo gabagabeeyay Seminaarka tignoolajiyada ee giraanta labaad ee Die Die

Bishii Maarso 30, 2024, Hangzhou Hanpai Mold Technology Co., Ltd. waxay martigelisay Seminarkii labaad ee Tiknoolajiyada Ring Die, oo ku martiqaaday marti sharaf ay ka mid yihiin Professor Ling Guoping oo ka socda Kulliyadda Sayniska Qalabka iyo Injineerinka ee Jaamacadda Zhejiang, Madaxweyne kuxigeenka Guo Xiaogang oo ka socda Machadka Hangzhou ee Sayniska Makaanikada, Injineer Sare Shen Liang, Kuxigeenka Maareeyaha Guud Fang Jianjun, Injineer Sare Yan Laiping, iyo Injineer Wang Yong oo ka socda Liyang Jinkun Forging Co., Ltd.

Intii lagu guda jiray shirkan, dooduhu waxay ku wareegsanaayeen falanqaynta guul-darrooyinka giraanta ee 2023. Khubaradu waxay u dhaadhaceen agabka suurtagalka ah iyo habraaca dayacanka ee gacan ka geysanaya guuldarrooyinka giraanta, iyagoo si qoto dheer ugala hadlaya arrinta.Intaa waxaa dheer, waxay soo jeediyeen hagaajin u dhiganta iyo qorshooyinka hagaajinta ee ku saabsan agabka iyo tignoolajiyada daaweynta kulaylka.