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Hanpai Mold e Phetha ka Katleho Semina ea Bobeli ea Ring Die Technology

Ka la 30 Hlakubele 2024, Hangzhou Hanpai Mold Technology Co., Ltd. e ile ea tšoara Seminara ea bobeli ea Ring Die Technology, e mema baeti ba hlomphehang ho kenyeletsa Moprofesa Ling Guoping oa Koleche ea Materials Science and Engineering Univesithing ea Zhejiang, Motlatsi oa Mopresidente Guo Xiaogang ho tloha Hangzhou Institute. oa Saense ea Mechini, Moenjiniere e Moholo Shen Liang, Motlatsi oa Motsamaisi Kakaretso Fang Jianjun, Moenjiniere e Moholo Yan Laiping, le Moenjiniere Wang Yong ho tsoa Liyang Jinkun Forging Co., Ltd.

Nakong ea kopano ena, lipuisano li ne li le holim'a tlhahlobo ea ring die failures ka 2023. Litsebi li ile tsa hlahlobisisa lintho tse ka 'nang tsa e-ba teng le ho ba le bofokoli ba ts'ebetso e tlatsetsang ho hlōleha ha ring die, ho kenya letsoho lipuisanong tse tebileng tabeng ena.Ho feta moo, ba ile ba etsa tlhahiso ea lintlafatso tse tsamaellanang le merero ea ntlafatso mabapi le lisebelisoa le mahlale a kalafo ea mocheso.

The Second Ring Die Technology Seminar (1) The Second Ring Die Technology Seminar (2) The Second Ring Die Technology Seminar (3) The Second Ring Die Technology Seminar (4)


Nako ea poso: May-27-2024