Ngomhla wama-30 kweyoKwindla ngo-2024, iHangzhou Hanpai Mold Technology Co., Ltd. yabamba iSemina yesibini yeRing Die Technology, imema iindwendwe ezibekekileyo kuquka noNjingalwazi uLing Guoping ovela kwiKholeji yezeNzululwazi kunye nobuNjineli kwiYunivesithi yaseZhejiang, uSekela Mongameli uGuo Xiaogang ovela kwiziko leHangzhou. weNzululwazi yezooMatshini, uNjineli oMkhulu uShen Liang, iSekela likaMphathi Jikelele uFang Jianjun, uNjineli oyiNtloko uYan Laiping, kunye noNjineli uWang Yong ovela kuLiyang Jinkun Forging Co., Ltd.
Ngethuba le nkomfa, iingxoxo zijikeleze uhlalutyo lokungaphumeleli kwe-ring 2023. Iingcali zihlolisise kwizinto ezinokuthi zibe buthathaka kunye nenkqubo ye-vulnerabilities enegalelo kwi-ring die failures, ukuzibandakanya kwiingxoxo ezinzulu kulo mbandela.Ngaphezu koko, bacebise uphuculo oluhambelanayo kunye nezicwangciso zokuphucula malunga nezixhobo kunye nobuchwepheshe bonyango lobushushu.
Ixesha lokuposa: May-27-2024