Ukusukela ngomhla we-18 ukuya kowe-20 ku-Epreli, ngo-2024, uMboniso woShishino lokuTya e-China ububanjwe kwi-Xiamen International Convention and Exhibition Centre.I-Hangzhou Hanpai Mold Technology Co., Ltd. ibonise umsesane wayo owenziweyo owenziwe ngokufanelekileyo kunye nowokugcina amandla uyafa kwi-C5 Comprehensive Exhibition Area.
Kuwo wonke lo mboniso, iingcali ezininzi eziphuma kumabala emidlalo asekhaya nakwamanye amazwe zithe zatyelela ukuze zihlole kwaye zibuze ngeemveliso zethu, bezibandakanya kwiingxoxo ezinzulu.Sidlulisa umbulelo wethu kubathengi bethu abatsha nabasele bekho, kunye noontanga bethu kwishishini, ngokubamba iHanpai Mold booth ngobukho babo.Sihlala sizibophelele ekuboneleleni ishishini ngeringi esebenzayo kunye neyonga umbane iyafa, sinqwenela ukuba ngumvelisi okumgangatho wehlabathi kulo mba, enikezela ngezisombululo zaseTshayina zophuhliso oluluhlaza kunye noluzinzileyo lwehlabathi.
Ixesha lokuposa: May-27-2024