NgoMashi 30, 2024, i-Hangzhou Hanpai Mold Technology Co., Ltd. isingathe iSemina yesibili ye-Ring Die Technology, imema izihambeli ezihlonishwayo okuhlanganisa noSolwazi Ling Guoping waseKolishi Lezinto Zesayensi Nobunjiniyela e-Zhejiang University, iPhini likaMongameli u-Guo Xiaogang ovela e-Hangzhou Institute. Wezesayensi Yezokusebenza, Unjiniyela Omkhulu u-Shen Liang, Iphini Lomphathi-Jikelele u-Fang Jianjun, Unjiniyela Omkhulu u-Yan Laiping, kanye noNjiniyela u-Wang Yong ovela ku-Liyang Jinkun Forging Co., Ltd.
Phakathi nale ngqungquthela, izingxoxo bezigxile ekuhlaziyweni kokuhluleka kwe-ring die ngo-2023. Ochwepheshe bacwaninga ezintweni ezingaba khona futhi bacubungule ubungozi obunomthelela ekuhlulekeni kwe-ring die, bahileleka ezingxoxweni ezijulile ngalolu daba.Ngaphezu kwalokho, bahlongoza ukuthuthukiswa okuhambisanayo kanye nezinhlelo zokusebenzisa ngokugcwele izinto ezisetshenziswayo kanye nobuchwepheshe bokwelapha ukushisa.
Isikhathi sokuthumela: May-27-2024