Ngomhla zingama-26 kuNdasa, 2023, i-Hangzhou Hanpai Mold Technology Co., Ltd. imeme uSolwazi Ling Guoping waseSikoleni Sezinto Sezisetshenziswa sase-Zhejiang University, u-Shen Liang, unjiniyela omkhulu we-Hangzhou Institute of Mechanical Science, u-Fang Jianjun, iphini lomphathi jikelele we-Liyang Jinkun Forging kanye no-Yan Laiping, unjiniyela omkhulu, kanye no-Wang Yonglai, unjiniyela wenkampani yethu babambe iqhaza kwisemina yobuchwepheshe be-ring die.Emhlanganweni, ochwepheshe benze ukuqonda okuphelele kweringi eyenza ukwelashwa kokushisa kokukhiqiza, bahlaziya izingozi ezingaba khona ezicashile kule nqubo, futhi benza izingxoxo ezijulile ngokuhluleka kokufa kweringi, futhi bahlongoza izinhlelo ezihambisanayo zokuthuthukisa nokwenza kahle.
Isikhathi sokuthumela: Mar-27-2023